Solder Joint Pull Test at Lois Lumpkin blog

Solder Joint Pull Test. Solder balls are pulled individually using. The ball shear tests ranged from 10 mm/s to 3000 mm/s and the ball pull tests ranged from 5 mm/s to 500 mm/s. Solder joint shear and pull testing are routinely used to evaluate the solder joint on the package level, however these methods do not currently. Combining with a test stand, more stable measuring becomes possible. All information is subject to change without prior notice. This test can evaluate the durability of a soldered joint of a lead and a land on a substrate from the time dependence of the pull strength of a reflow.

45degree Pull Test of Solder Joints on QFP Lead (JIS Z31986 2003
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Solder balls are pulled individually using. This test can evaluate the durability of a soldered joint of a lead and a land on a substrate from the time dependence of the pull strength of a reflow. Combining with a test stand, more stable measuring becomes possible. The ball shear tests ranged from 10 mm/s to 3000 mm/s and the ball pull tests ranged from 5 mm/s to 500 mm/s. All information is subject to change without prior notice. Solder joint shear and pull testing are routinely used to evaluate the solder joint on the package level, however these methods do not currently.

45degree Pull Test of Solder Joints on QFP Lead (JIS Z31986 2003

Solder Joint Pull Test This test can evaluate the durability of a soldered joint of a lead and a land on a substrate from the time dependence of the pull strength of a reflow. Combining with a test stand, more stable measuring becomes possible. This test can evaluate the durability of a soldered joint of a lead and a land on a substrate from the time dependence of the pull strength of a reflow. The ball shear tests ranged from 10 mm/s to 3000 mm/s and the ball pull tests ranged from 5 mm/s to 500 mm/s. All information is subject to change without prior notice. Solder joint shear and pull testing are routinely used to evaluate the solder joint on the package level, however these methods do not currently. Solder balls are pulled individually using.

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