What Is Head In Pillow Defect at Raymonde Elias blog

What Is Head In Pillow Defect. It refers to a condition where the solder joint between the bga ball and the pcb pad does not form a complete. Head in pillow (hip) joint udefinition:

Process Guidelines to Ensure Optimal SMT Electronics Assembly KIC Thermal
from kicthermal.com

It refers to a condition where the solder joint between the bga ball and the pcb pad does not form a complete. Head in pillow (hip) joint udefinition:

Process Guidelines to Ensure Optimal SMT Electronics Assembly KIC Thermal

What Is Head In Pillow Defect It refers to a condition where the solder joint between the bga ball and the pcb pad does not form a complete. Head in pillow (hip) joint udefinition: It refers to a condition where the solder joint between the bga ball and the pcb pad does not form a complete.

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