1601: ELECTRONIC MEASUREMENTS AND INSTRUMENTATION

Module 1

Introduction- Measurements- Monitoring, Control, Analysis. Instruments- Transducer, Signal Conditioner and Transmitter, Display/Recording Devices. Static characteristics of Instruments. Estimation of Static errors and reliability-errors, types of errors, probability of errors, limiting errors, Reliability Principles. Dynamic characteristics of Instruments- Transfer function-Zero, first and second order instruments-Dynamic response of first and second order Instruments.

Module 2

Transducers and Sensors: Transducers- active and passive, Magnetic effect based Transducers. - Selection Criteria- Smart Sensors and IEEE 1451 Standard. Temperature measurements-RTD, Thermocouples. Displacement Measurement- Strain Measurement-Pressure Measurement- Measurement of acceleration, force, and Torque. LVDT. Piezo-electric transducers. Bridge measurements:-dc bridges for low, medium and high resistance-ac bridges for capacitance and inductance. Sources of error in bridge circuits- Precautions. Vector impedance meter. Multimeters: - Principles of analog and digital multimeter.

Module 3

Signal generators: - Sine-wave Generators-AF and RF Signal Generators- Non-sinusoidal Generators, Function generator- Sweep frequency generator- Frequency synthesizers. Digital Signal Generators- Arbitrary Wave form Generator, Arbitrary Function generator, Data Generator. Signal analyzers-Wave Analyzer –Harmonic Distortion Analyzer, Spectrum Analyzer. FFT Analyzer, Vector Analyzer, Logic Analyzer. Digital storage oscilloscope (DSO).Recording instruments- Strip chart recorders, x-y- recorders.

Module 4

Industrial Instrumentation: Basis of Pressure measurements, Flow measurements and Level Measurement. Data Acquisition System- Telemetry- characteristics and different types. Industrial Communication Techniques-OSI Net Work Model, Network Topologies, Interface Standards- RS 232, RS 422, RS 423, RS 485, IEEE 488 (GPIB), HART, Ethernet or CSMA/CD. Virtual instrumentation Systems- What It is, Problem to Tackle. Instrumentation in Hazardous Areas.


1602 MICROWAVE TECHNIQUES AND DEVICES

Module 1

Introduction to microwaves - frequency range, significance, applications; Guided waves: TE, TM, TEM waves, Velocities of propagation; Transmission line theory: Lumped element circuit model, Transmission line parameters, Transmission Line equations, Characteristic impedance, Input impedance of a Lossless Line, short circuited and open circuited lines, Standing Waves, Reflection Coefficient, VSWR, Impedance matching devices – Quarter wave transformer, Stub matching, Smith Chart and its applications; Waveguides - Rectangular Waveguide: TE waves, TM waves, dominant and degenerate modes, Impossibility of TEM waves in wave guides; Excitation of modes in Rectangular Waveguides; Planar Transmission lines: Strip lines, Microstrip lines, Slot lines and Coplanar lines.

Module 2

Scattering matrix - Concept of N port scattering matrix representation - Properties of S matrix- S matrix formulation of two-port junction; Microwave Passive devices - Tee junctions – E plane Tee, H plane Tee, Magic Tee, Rat race, Two hole directional coupler, Isolator, Circulator, Phase shifter, Attenuator, Power divider; S matrix of E plane Tee, H plane Tee, Magic Tee, Directional coupler, Circulator only; Microwave Resonators: Transmission line resonators – λ/2 and λ/4 resonators, Rectangular and Circular Cavity resonators - Resonant frequency and Q factor, Cavity excitation and tuning, Coupled cavities; Microstrip resonators – Disc and ring resonators

Module 3

Microwave filters – Filter implementation at Microwave frequencies, Low Pass Butterworth and Chebyshev Filter design by Insertion loss method and implementation using discrete components, Design of Stepped impedance Butterworth and Chebyshev Low Pass filters.Microwave measurements and applications: Measurement of Power, VSWR, frequency, wavelength, insertion loss, impedance and attenuation; Basic concepts of Network Analyzer and Anechoic chamber; Applications of Microwaves - ISM applications, Microwave radiation hazards.

Module 4

Solid state microwave devices:- Diodes – Principle of operation and applications of Crystal diode, PIN diode, Varactor diode, Tunnel diode, Gunn diode and Avalanche Transit time devices; Basic principle of operation of parametric amplifiers, Manley-Rowe power relations, Negative resistance amplifiers; Microwave tubes - High frequency limitations – Structure and Principle of operation of Two Cavity Klystron, Reflex Klystron, Traveling Wave Tube Amplifier, Magnetron Oscillator (detailed mathematical analysis not needed), Characteristics of Microwave Transistors – FET and BJT.


1603 VLSI DESIGN

Module 1

VLSI process integration: fundamental considerations in IC processing - NMOS IC technology - CMOS IC technology- n-well process, p-well process, twin-tub process, silicon on insulator - Ion implantation in IC fabrication.Second order MOS device effects: short-channel effect, narrow width effect, sub-threshold current, field dependent carrier mobility, device saturation characteristics, drain punch through, hot electron effect.

Module 2

Switch logic- pass transistors and transmission gates, Gate logic - The basic inverter using NMOS - pull up to pull down ratio- transfer characteristics- Alternate forms of pull up. CMOS logic – inverter, NAND, NOR, 0 compound gates - CMOS inverter DC characteristics. Design rules and Layout of static MOS circuits: general principles & steps of lay-out design - use of stick diagrams – NMOS and CMOS design rules - Layout examples of inverter, NAND and NOR - Interlayer contacts, butting and buried contacts - use of layout tools like MICROWIND for integrated circuits.

Module 3

Circuit characterization and performance estimation: resistance estimation - sheet resistance, capacitance estimation - Switching characteristics of CMOS inverter- rise time, fall time, delay time, delay unit, inverter delays - driving large capacitive loads - cascaded inverters, super buffers, BiCMOS drivers. Scaling of MOS circuits: scaling models and scaling factors for device parameters, limitations of scaling.

Module 4

Timing issues in VLSI system design: timing classification- synchronous timing basics – skew and jitter- latch based clocking- self timed circuit design - self timed logic, completion signal generation, self timed signaling–synchronizers and arbiters.


1604 COMMUNICATION ENGINEERING III

Module 1

Entropy and Loss-less Source Coding: Entropy, Entropy of discrete random variables- Joint, conditional and relative entropy- Chain rule for entropy, Mutual information and conditional mutual information, Relative entropy and mutual Information Lossless source coding- Discrete Memory-less sources, Uniquely decodable codes- Instantaneous codes- Kraft's inequality – Average codeword length, Optimal codes- Huffman coding, Arithmetic Coding, Lemplel-Ziv Coding, Shannon's Source Coding Theorem.

Module 2

Channel Capacity and Coding Theorem: Channel Capacity- Discrete memory-less channels (DMC) and channel transition probabilities, Capacity computation for simple channels- Shannon’s Channel Coding Theorem, Converse of Channel Coding Theorem Continuous Sources and Channels: Differential Entropy- Mutual information- Waveform channels- Gaussian channels- Shannon-Harley Theorem, Shannon limit, efficiency of digital modulation schemes-power limited and bandwidth limited systems.

Module 3

Introduction to linear algebra- vector spaces-matrices. Coding – linear block codes-generator matrices-parity check matrices-encoder-syndrome and error correction-minimum distance-error correction and error detection capabilities- BCH codes-description-coding & decoding –Reed Solomon codes-coding & decoding cyclic codes-coding and decoding.

Module 4

Convolutional codes-encoder -state diagram-distance properties-maximum likelihood decoding-viterbi decoding-sequential decoding interleaved convolutional codes-Turbo coding- coding & decoding -Trellis coding- coding & decoding- Low-Density Parity check (LDPC) codes.


1605 CONTROL SYSTEMS ENGINEERING

Module 1

General schematic diagram of control systems - open loop and closed loop systems – concept of feedback - modeling of continuous time systems – Review of Laplace transform - transfer function - block diagrams – signal flow graph - mason's gain formula - block diagram reduction using direct techniques and signal flow graphs - examples - derivation of transfer function of simple systems from physical relations - low pass RC filter - RLC series network - spring mass damper.

Module 2

Analysis of continuous time systems - time domain solution of first order systems – time constant - time domain solution of second order systems - determination of response for standard inputs using transfer functions - steady state error - concept of stability - Routh- Hurwitz techniques - construction of bode diagrams - phase margin - gain margin - construction of root locus - polar plots and theory of Nyquist criterion - theory of lag, lead and lag-lead compensators.

Module 3

Basic elements of a discrete time control system - sampling - sample and hold - Examples of sampled data systems – pulse transfer function - Review of Z-transforms - system function - mapping between s plane and z plane - analysis of discrete time systems –- examples - stability - Jury's criterion - bilinear transformation – stability analysis after bilinear transformation - Routh-Hurwitz techniques - construction of bode diagrams - phase margin - gain margin - digital redesign of continuous time systems.

Module 4

Introduction to the state variable concept - state space models - phase variable and diagonal forms from time domain - diagonalization - solution of state equations - homogenous and non homogenous cases - properties of state transition matrix - state space representation of discrete time systems - solution techniques - relation between transfer function and state space models for continuous and discrete cases - relation between poles and Eigen values – Controllability and observability.


1606 E1 OPTICAL FIBRE COMMUNICATION

Module 1

Overview of optical communication systems, History of optical communications, Wave theory of light, Reflection and refraction of plane waves; Optical waveguides Planar waveguides, Characteristics of optical fibers , numerical aperture, Wave propagation in multimode and single-mode optical fibers, Coupling into and out of fibers, attenuation, group-velocity dispersion, optical nonlinearities, polarization-mode dispersion.dispersionshifted and polarization maintaining fiber

Module 2

Optical sources and transmitters: Optical sources, Physics of light emission and amplification in semiconductors, -direct and indirect band gap materials-LED structures- quantum efficiency- modulation. Laser diodes- rate equations- diode structure- single mode laser-modulation- temperature effects- quantum cascade lasers-vertical cavity surface emitting lasers- modal noise- partition noise- reflection noise. Light coupling-source to fiber coupling.Photo detectors-PIN, APD, Photo detector noise - response time- structure of detectors- receiver units.

Module 3

Components of fiber optic networks: – couplers - splitters- semiconductor optical amplifiers- Erbium doped fiber amplifiers- wavelength division multiplexers/ demultiplexers. Filters- isolators-circulators-optical switches- Wavelength converters- Fiber gratings tunable sources-tunable filters.

Module 4

Dispersion in optical communication systems, Dispersion in single-mode and multimode fibers, Dispersion-induced pulse broadening in single-mode fiber, coherent & non coherent detection, channel capacity, various limits of transmission rate- Optical link design, Power and noise budget, Jitter and rise time budgets.


1606E2 DIGITAL IMAGE PROCESSING

Module 1

Digital Image Fundamentals: Representation of digital image -Elements of visual perception – Image sampling and quantization- Basic relationship between pixels.Review of Matrix Theory: Row and column ordering-Toeplitz, Circulant and Block Matrices Image Transforms: 2D DFT, Hadamard, Haar, DCT, Wavelet Transforms.

Module 2

Image Enhancement: Spatial domain methods: Basic Gray Level Transformations-Histogram Processing: Equalization and specification- Fundamentals of Spatial Filtering: Smoothing, Sharpening spatial filters. Frequency domain methods: low pass filtering, high pass filtering, homomorphic filtering.

Module 3

Image segmentation: Detection of discontinuities: Point Line and Edge Detection - Edge linking and boundary detection - Hough transform – Thresholding - Region based segmentation: Region growing-Region splitting and merging - Use of motion in segmentation.Representation and Description: Representation, Boundary Descriptors: Shape numbers, Fourier descriptors, statistical moments - Regional Descriptors: Topological descriptors, texture.

Module 4

Image Restoration: Degradation Model- Restoration in the presence of Noise only-Spatial Filtering - Periodic Noise reduction by frequency domain filtering- Linear position Invariant degradations-Estimating the degradation function- Inverse filtering - Wiener filter - Constrained Least squares filtering.Fundamentals of Colour image processing: Colour models - RGB, CMY, YIQ, HIS - Pseudo colour image processing - intensity slicing, gray level to color transformation.


1606E3 HARDWARE MODELLING

Module 1

Introduction: Hardware Abstraction- Basic Terminology- Entity Declaration- Architecture Body- Basic Language Elements –Identifiers- Data Objects- Data Types- Operators. Example designs: Basic Combinational Circuits.Behavioural Modelling: Process Statement- Variable Assignment Statement- Signal Assignment Statement- Wait Statement- If Statement - Case Statement- Null Statement- Loop Statement- Exit Statement- Next Statement- Assertion Statement- Report Statement- Other Sequential Statements- Multiple Processes

Module 2

Dataflow Modelling: Concurrent Signal Assignment Statement- Concurrent versus Sequential Signal Assignment- Multiple Drivers- Conditional Signal Assignment Statement- Modelling of Basic Binary Arithmetic Circuits, Sequential Circuits, Registers.Structural Modelling: Component Declaration- Component Instantiation- Resolving Signal Values - Generics- Configurations

Module 3

Subprograms- Subprogram Overloading- Operator Overloading- Signatures- Packages and Libraries. Models of RAM.Advanced Features: Generate Statements- Aliases- Attributes.Model Simulation: Simulation- Writing a Test Bench- Reading Vectors from a Text File.Modelling Delays- State Machine Modelling.

Module 4

CPLDs and FPGA: FPGA types- FPGA versus custom VLSI- FPGA based system design FPGA programming technologies: antifuse-static RAM-EPROM-EEPROM.FPGA families: Actel- Actel1 logic module, Xilinx- xilinx LCAXC3000CLB, Altera-Altera FLEX logic element. Logic expander.


1606E4 NANO ELECTRONICS

Module 1

Introduction to nano Electronics, Top down and bottom-up approach- classical particles- waves quantum particles- Quantum mechanics of Electron – Time dependentshordinger equation - Probability density- Free and confined Electron- finite potential well- Electron in a periodic potential well- kronig and penny model- Band theory

Module 2

The physics of low dimensional structures - basic properties of two dimensional semiconductor nanostructures, square quantum wells of finite depth, parabolic and triangular quantum wells - -Tunneling Junction- resonant tunneling - coulomb blockade

Module 3

Review of density of states-Semiconductor hector junction - Quantum well – Nano wires and quantum wires - Quantum dots and nanoparticles, Fabrication Techniques. Carrier transport in nano devices-Ballistic transport. Transport of spin- spintronic devices.

Module 4

Nanoelectonic devices and systems - MODFETS, heterojunction bipolar transistors, resonant tunnel effect, RTD, RTT, hot electron transistors, Carbon nanotube transistor, heterostructure semiconductor laser, quantum well laser, quantum dot LED, quantum dot laser, quantum well optical modulator, quantum well sub band photo detectors, nanoswitches