Everything You Need to Know About Micro Vias On Fr4 Material
Microvia Drilling
High density interconnect (HDI) technology requires connection holes with diameters of at least 50 μm. Microvias can be laser-drilled in RCC, FR4 , FR5, Teflon ®, and Thermount ® materials . When drilling is performed with the UV laser, both the top copper layer as well as the epoxy resin and fiberglass substrates are pierced in one operation.
Micro Vias On Fr4 Material
Introduction In the evolving landscape of printed circuit board manufacturing, FR-4 remains a cornerstone material due to its balance of cost, reliability, and performance. Advanced techniques like high-density interconnect (HDI) and microvias enable engineers to pack more functionality into smaller footprints using FR-4 substrates. These methods address the demands of modern electronics ...
Micro Vias On Fr4 Material
PDF Introduction to Microvia Design
Micro Vias On Fr4 Material
Other characteristics are 10 mil via pad, 3 -5 mil via holes, mainly 4-mil lines/spacing and a board thickness around 40 mil. The material is FR4 or FR4 with a higher Tg (160°C).
