WiLinkTM 8Q .65-mm PitchFlipChipBall Grid Array Package Reference Guide This document provides board mount application guidelines for Pb-freeflipchipBGApackages with a 0.65 millimeter pitch, including device handling and management, PCB design guidelines, PCB assembly parameters,reworkprocesses and troubleshooting.
This application note contains guidelines on board design rules, board assembly parameters, thermal management, andreworkprocess for XilinxFlip-ChipBGApackages.
A collaborative approach in partnership with the assembly manufacturer was employed to develop customer collateral that includes handling; reflow/reworkand heat sink attach guidelines for the moldedflip-chipBGApackage. A detailed thermal modeling of the package was performed to characterize the thermal performance of the package.
ReworkFlip-ChipreworkFlipchipcomponents have rarely been used in PCB assembly, but they are becoming more and more important as the need for miniaturization of electronic assemblies is growing.
4.Flip-ChipBGA(FCBGA)Chipsare mounted face-down (flipped) onto the substrate. This allows shorter electrical paths, leading to faster performance and better heat dissipation. Common in high-performance CPUs, GPUs, and networkingchips. 5. CeramicBGA(CBGA) Uses a ceramic substrate instead of plastic.
Summary Xilinxflip-chipBGApackages are offered for Xilinx high-performance FPGA products. Unlike wire-bond packaging in which the die is attached to the substrate face up and the connection is made by using wire, the solder bumped die inflip-chipBGAis flipped over and placed face down, with the conductive bumps connecting directly to the matching metal pads on the laminate substrate.
