Q1 FY2026 Earnings Recap

ASML Holding N.V. (ASML)

Reported Apr 15th 2026

News Summary

  • ASML reported Q1 2026 revenue of EUR 8.8 billion (up 13% year over year) with a 53% gross margin at the high end of guidance, and EPS of EUR 7.15 beat consensus by 8.4%, confirming that AI-driven semiconductor capex is translating directly into equipment demand with CEO Christophe Fouquet stating memory customers are sold out through 2026 and beyond while advanced logic customers race to ramp 2nm capacity for AI products.
  • ASML raised full-year 2026 revenue guidance to EUR 36-40 billion from a prior EUR 34-39 billion range, with management explicitly stating the bandwidth already absorbs potential export control outcomes and that non-EUV demand was upgraded from flat to growth — a signal that AI infrastructure investment is broad-based across the chip supply chain, not just concentrated in leading-edge EUV.
  • Goldman Sachs raised its price target on ASML to EUR 1,570 from EUR 1,450 and reiterated Buy, lifting 2026-2030 revenue and gross profit estimates by 6-10% on the strength of Q1 results and the raised outlook, while the stock fell modestly post-earnings despite the beat, reflecting investor expectations that were already pricing in strong results at roughly 40x forward earnings.
  • EUV tool productivity is being actively pushed upward — the NXE:3800E was upgraded to 230 wafers per hour, the next-gen NXE:3800F spec raised to 260, and a 1,000-watt source demonstration extends Low NA EUV to 330 wafers per hour by 2031 — meaning the machines foundries use to manufacture AI chips like Nvidia GPUs are getting materially more productive per unit, compounding capacity without requiring proportional new tool shipments.
  • ASML invested EUR 1.3 billion in a strategic partnership with Mistral AI, with CFO Roger Dassen citing a concrete field operations example where a wafer stage failure diagnostic that previously took over 10 hours was reduced to 8 minutes using a Mistral-developed model, framing AI as both a demand driver for ASML's tools and an operational capability being embedded into its own service infrastructure.

Financial Highlights

MetricQ2 '24Q3 '24Q4 '24Q1 '25Q2 '25Q3 '25Q4 '25Q1 '26
Revenue$6.2B$7.5B$9.3B$7.7B$7.7B$7.5B$9.7B$8.8B
Rev Growth (YoY)-9.6%11.9%28.0%46.3%23.2%0.7%4.9%▲ 13.2%
Gross Margin51.5%50.8%51.7%54.0%53.7%51.6%52.2%▲ 53.0%
Operating Margin29.4%32.7%36.2%35.4%34.6%32.8%35.3%▲ 36.0%
EV/Sales60.6x39.4x27.6x30.3x33.9x42.0x35.2x49.6x

Earnings Call Highlights

ASML's Q1 2026 call was confident and bullish, with management projecting an unmistakably strong demand environment driven almost entirely by AI infrastructure investment. Christophe Fouquet's tone was assertive on supply constraints — memory customers are sold out through 2026 and beyond, and advanced logic customers are racing to ramp 2nm capacity for AI products — framing ASML as a structural beneficiary rather than a cyclical one. Management raised and narrowed full-year revenue guidance to EUR 36–40 billion, signaling genuine conviction rather than cautious optimism. Analyst pressure was notably absent from this format, but the upward revision to non-EUV demand and the explicit absorption of export control risk within guidance suggest management is getting ahead of potential headwinds. The dominant theme is that AI-driven semiconductor capex is accelerating faster than ASML can currently supply, making capacity expansion the central strategic imperative.

  • AI infrastructure investment is the explicit demand driver: Fouquet stated that memory customers are 'sold out for 2026' with supply constraints extending beyond, and that advanced logic customers are building multi-node capacity while ramping 2nm specifically for AI products — a direct signal that AI chip demand is pulling hard on the entire semiconductor supply chain.
  • ASML raised full-year 2026 revenue guidance to EUR 36–40 billion (up from a wider, lower prior range) and notably upgraded non-EUV expectations from flat to growth, with the installed base business — a fast-capacity lever for chipmakers — cited as a strong growth contributor, all while stating the range already accommodates potential export control outcomes.
  • EUV throughput is being actively pushed: the NXE:3800E was upgraded from 220 to 230 wafers per hour, the next-gen NXE:3800F spec was raised to 260 wafers per hour (from 250), and a 1,000-watt source demonstration secures Low NA EUV extendibility to 330 wafers per hour by 2031 — meaning the tools powering leading-edge AI chip fabs are getting meaningfully more productive.
  • High NA EUV is approaching production readiness, with customers publicly reporting at SPIE that it reduces mask counts from 3 to 1 and process steps from 100 to 10 for EUV layers, and the ecosystem already demonstrating extendibility to 18nm line/space pitch for logic and 28nm hole size for memory — covering 3–4 future nodes, which matters for the roadmap of every leading AI chip manufacturer.